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Durable Waffle Pack Chip Trays with Uniform Grid to Secure Fine Pitch ICs

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Durable Waffle Pack Chip Trays with Uniform Grid to Secure Fine Pitch ICs

Name: Durable Waffle Pack Chip Trays with Uniform Grid to Secure Fine Pitch ICs
Brand: Hiner-pack
Price: 1.35 USD

Buy cheap Durable Waffle Pack Chip Trays with Uniform Grid to Secure Fine Pitch ICs product

Model Number : HN25002

Mold Type : Injection

Capacity : 24x23=552 PCS

MOQ : 500 pcs

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Payment Terms : T/T

Color : Black

Cavity Size : 0.70X0.64X0.47 mm

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Quality Assurance : Delivery Guarantee, Reliable Quality

Outline Line Size : 50.7×50.7×4 mm

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Brand Name : Hiner-pack

Reusable : Yes

Packing Level : Transport package

Warpage : Warpage MAX 0.25mm

Tray Shape : Rectangular

Certification : ROHS, ISO

Ic Type : BGA,QFP,QFN,LGA,PGA

Place of Origin : China

Clean Class : General And Ultrasonic Cleaning

Packaging Details : CARTON, PALLET

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Durable Waffle Pack Chip Trays with Uniform Grid to Secure Fine Pitch ICs

Tired of ordinary trays failing to protect compact fine pitch microchips during turnover?

Boast high-density uniform cavity layout to hold numerous tiny components separately. Eliminate mutual friction, displacement and surface damage amid frequent workshop operations.

Deliver sustained electrostatic discharge performance. Keep fragile semiconductor devices safe from static risks and support long-term repeated circulation.

Adapt cavity arrangement and overall sizes according to component specifications. Create exclusive storage solutions to fit various electronic production scenarios.

Key Features/ Benefits

Constant ESD performance for delicate microchips
High-density cavities for large-capacity storage
Stackable design to cut warehouse occupation
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs

Specifications

Brand		Hiner-pack
Model		HN25002
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4 mm
Cavity Size		0.70X0.64X0.47mm
Matrix QTY		24x23=552 PCS
Warpage		MAX 0.25mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Ideal for storing and transporting microchips, integrated circuits and miniature electronic parts. Isolate each component to reduce scratch, collision and electrostatic damage risks.

Well suited for semiconductor factories, component distributors and SMT workshops. Serve chip testing, production transfer and finished product logistics management.

Packaging & Shipping/ Services

We arrange neat palletized packing lined with shockproof fillers. Reinforced export cartons prevent squeezing and impact during sea and air shipments.

Packing quantity can be adjusted as your request. Strict inspection before shipment ensures goods reach your destination in perfect condition.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

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